SAN JOSE, Calif. — ASM Pacific Technology Ltd. and Microbonds Inc. have formed a strategic alliance to enable a new wire-bond packaging technique, dubbed X-Wire Technology. The cooperative ...
Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...
This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...
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