Nasdaq

Teledyne’s new high-resolution multispectral line scan camera extends defect detection beyond the surface

WATERLOO, Ontario, April 05, 2022 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce the release of its multispectral Camera Link HS (CLHS) line ...
Nasdaq

WiMi Developed Digital Holography-Based Semiconductor Wafer Defect Detection Technology

BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that ...
Automation World

Teledyne’s New SWIR Line Scan Camera Enables Defect Detection Beyond the Visible

Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, is pleased to announce its first short-wave infrared (SWIR) line scan camera for machine vision. The new ...
Semiconductor Engineering

Nearly Invisible: Defect Detection Below 5nm

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...
Semiconductor Engineering

Comparison Of State-Of-The-Art Models For Socket Pin Defect Detection

This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
Automation World

Teledyne’s New High-Resolution Multispectral Line Scan Camera Extends Defect Detection Beyond the Surface

Teledyne DALSA introduces its Linea ML 8k multispectral CLHS line scan camera for improved defect detectability with a single scan. Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is ...