Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...

Most of us use our cell phones, smart watches and other electronic devices without giving much thought to the components and how they fit and work together. But it’s a complex problem that ...

NIST (The US National Institute of Science and Technology) scientists have developed a new process for packaging photonic integrated circuits so they can survive and operate in some of the most ...

PENANG: Global Electronics Association and MIMOS Bhd have signed a memorandum of understanding (MoU) to strengthen Malaysia's ...

The U.S. high-end semiconductor packaging market is valued at about USD 4.95 billion in 2025 and is projected to grow at a CAGR of 11.68% from 2026 to 2035, reaching nearly USD 14.93 billion. Growth ...

Modeling and simulation is an efficient way of analyzing packaging and testing processes to develop a strong understanding of how they may impact designs and performance. Multiphysics simulation ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

Chip Packaging Blurs Lines Between IC Fabrication And Test The key to packaging innovation often lies with production, where making component packages smaller may be inherently linked with making them ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Austin-based 3M Microelectronic Project today said it has developed technology that it claims will double the performance of high-end opto-electronic packages. The company, a division of St. Paul, ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...