Young, T. , Guymon, J. , Pankow, M. and Ngaile, G. (2026) A Material Removal Prediction Framework for Ball EEM Polishing in ...

Researchers have designed a robust image-based anomaly detection (AD) framework with illumination enhancement and noise suppression features that can enhance the detection of subtle defects in ...

For collision repair shops, the paint correction step comes at the end of a long and expensive process. It is also where a hidden problem tends to surface: many conventional compounds contain fillers ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Figure 1. Ultrasonic testing using pulse echo and through-transmission methods. Pulse echo (left and center) uses a transducer that sends and receives ultrasound energy, producing both A- and B-scan ...

Defect states refer to electronic energy levels that arise from imperfections or irregularities in the crystal structure of materials, particularly in semiconductors and insulators. These ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...